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TSOP62.., TSOP64..
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Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
7.5
Pick and place area. TT taping
7.2
A
1
0.5 ± 0.15
1.27
4
0.3 4x
0.1
0.1
(1.4)
2.9
3 x 1.27 =
3.81
0.4 A
4
5.51
Not indicated tolerances ± 0.3
Pick and place area. TR taping
2.6
Footprint
3 x 1.27 = 3.81
technical drawings
according to DIN
specifications
Drawing-No.: 6.544-5341.01-4
Issue: 8; 02.09.09
16776
ASSEMBLY INSTRUCTIONS
R 1.7
1.27
0.9
Reflow Soldering
? Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
? Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
? Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
? Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
? Finish soldering within 3 s
? Handle products only after the temperature has cooled off
Rev. 1.1, 05-Feb-14
6
Document Number: 82463
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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